mad00062fem mn101e29 series type mn101e29g MN101EF29G internal rom type mask rom flash rom (byte) 128k 128k+4k ram (byte) 6k package (lead-free) lqfp100-p-1414, qfp100-p-1818b minimum instruction execution time 50 ns (at 2.2 v to 5.5 v, 20 mhz) *: at internal 2 , 3 , 4 , 5 , 6 , 8 , 10 times oscillation used ? interrupts 6 external interrupts. 28 internal interrupts reset. nmi. external 0 to 4 . timer 0 to 4 . timer 6 . timer 7 (2 systems). timer 8 (2 systems). timer 9 (2 systems). time base. serial 0 (2 systems). serial 1 (2 systems). serial 2 (2 systems). serial 3 (2 systems). serial 4. serial 5 . a/d conversion. automatic transfer (2 systems). key interrupt ? timer counter 8-bit timer 7 timer 0 .................. timer pulse output. event count. added pulse ( 2-bit) type pwm output. remote control carrier output. simple pulse width measurement. real time output control timer 1 .................. timer pulse output. event count. 16-bit cascade connected (timer 0, 1 ). timer synchronous output timer 2 .................. timer pulse output. event count. added pulse ( 2-bit) type pwm output. simple pulse width measurement. 24-bit cascade connected (timer 0, 1, 2 ). timer synchronous output. real time output control timer 3 .................. timer pulse output. event count. remote control carrier output. 16-bit cascade connected (timer 2, 3). 32-bit cascade connected (timer 0, 1, 2, 3) timer 4 .................. timer pulse output. added pulse ( 2-bit) type pwm output. event count. serial transfer clock output. simple pulse width measurement timer 6 .................. 8 -bit freerun timer. time base timer timer a .................. event count. baud rate timer. clock output for peripheral function 16-bit timer 3 timer 7 .................. timer pulse output. event count. high accuracy pwm. high performance igbt output (cycle/duty continuous variable). timer synchronous output. input capture (both edge available). real time output control. double buffer compare register timer 8 .................. timer pulse output. event count. high accuracy pwm output (cycle/duty continuous variable). pulse width measurement. input capture (both edge available). 32-bit cascade connected (timer 7, 8). 32-bit pwm output. synchronous output event. double buffer compare register timer 9 .................. timer pulse output. event count. high accuracy pwm output (cycle/duty continuous variable). pulse width measurement. input capture (both edge available). real time output control. double buf fer compare register watchdog timer 1 ? serial interface synchronous type/uart (full-duplex) 4: serial 0 to 3 synchronous type/multi-master i 2 c 1: serial 4 i 2 c slave 1: serial 5 ? dma controller 2 systems. maximum transfer cycles are 255 starting factor: external request. internal event. software ? i/o pins i/o 90 : common use. speci?ed pull-up/pull-down resistor available. input/output selectable (bit unit) ? a/d converter 10-bit 16 channels ? d/a converter 8-bit 4 channels ? display control function lcd: 55 segments 4 commons (static, 1/2, 1/3, or 1/4 duty) 1/3 bias usable if vlc 1 vdd
mad00062fem mn101e29g, MN101EF29G ? special ports buzzer output. inverted buzzer output. remote control carrier output. high-current drive port ? rom correction correcting address designation: up to 7 addresses possible ? pin assignment lqfp100-p-1414, qfp100-p-1818b an0, tm0ioa, rmou ta , pa 0 an1, tm1ioa, pa 1 an2, tm2ioa, pa 2 an3, tm3ioa, pa 3 an4, tm4ioa, pa 4 an5, tm7ioa, pa 5 an6, tm8ioa, pa 6 an7, tm9ioa, pa 7 vref+ mmod at rs t nrst , p2 7 xo, p9 1 xi, p9 0 vs s osc1 osc2 vdd5 vdd1 8 p96 dmod led0, tm7iob, sbi1a, rxd1a, p0 0 led1, tm8iob, sbo1a, txd1a, p0 1 led2, tm9iob, sbt1a, p0 2 led3, tm0iob, tm2iob, rmoutb, p0 3 p41, sbi3b, rxd3b, seg3 4 p40, sbo3b, txd3b, seg3 5 p36, seg3 6 p35, sbi4b, seg3 7 p34, sbt4b, scl4b, seg38 p33, sbo4b, sda4b, seg3 9 p32, sbt2b, seg40 p31, sbi2b, rxd2b, seg4 1 p30, sbo2b, txd2b, seg4 2 p1 6, tm8ioc, nbuzzerb , seg4 3 p15, tm7ioc , buzzer b, seg4 4 p14, tm4ioc, seg4 5 p13, tm3ioc, seg4 6 p12, tm1ioc, seg4 7 p1 1, tm2ioc, seg4 8 p10, tm0ioc, rmoutc, seg4 9 p24, irq4, seg5 0 p23, irq3, seg5 1 p22, irq2, seg5 2 p21, irq1, acz1, seg5 3 p20, irq0, acz0, seg5 4 p07, led7, da_a p06, led6, sbt3 a p05, led5, sbi3a, rxd3 a p04, led4, sbo3a, txd3a p72, sbt2a, nwe, seg 9 p71, sbi2a, rxd2a, a7, seg10 p70, sbo2a, txd2a, a6, seg 11 p67, sbt4a, scl4a, a5, seg12 p66, sbo4a, sda4a, a4, seg13 p65, sbi4a, a3, seg14 p64, tm4iob, a2, seg15 p63, tm3iob, a1, seg16 p62, tm1iob, a0, seg17 p61, da_b, seg18 p60, seg19 p50, sbo0a, txd0a, key0, d0, seg20 p51, sbi0a, rxd0a, key1, d1, seg21 p52, sbt0a, key2, d2, seg22 p53, buzzera, key3, d3, seg23 p54, nbuzzera, key4, d4, seg24 p55, key5, d5, seg25 p56, key6, d6, seg26 p57, key7, d7, seg27 p47, scl5b, seg28 p46, sda5b, seg29 p45, sbt0b, seg30 p44, sbi0b, rxd0b, seg31 p43, sbo0b, txd0b, seg32 p42, sbt3b, seg33 sda5a, nre, seg8, p7 3 scl5a, ncs, seg7, p7 4 sbo1b, txd1b, a8, seg6, p7 5 sbi1b, rxd1b, a9, seg5, p7 6 sbt1b, a10, seg4, p7 7 tm9od0, sdo0, a1 1, seg3, p8 0 tm9od1, sdo1, a12, seg2, p8 1 tm9od2, sdo2, a13, seg1, p8 2 tm9od3, sdo3, a14, seg0, p8 3 tm9od4, sdo4, a15, com0, p8 4 tm9od5, sdo5, a16, com1, p8 5 sdo6, a17, com 2 , p8 6 sdo7, a18, com 3 , p8 7 a19, vlc3 , p9 2 ndk, vlc 2 , p9 3 da_c, vlc 1 , p9 4 da_d , p9 5 an15 , pb 7 an14 , pb 6 an13 , pb 5 an12 , pb 4 an 11 , pb 3 an10 , pb 2 an 9 , pb 1 an 8 , pb 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805
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